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• SILICON & SYSTEMS PLATFORM

Purpose-Built Silicon for
Advanced AI.

FairView Semiconductor unifies HBM4 memory architecture and GPU compute from individual silicon dies to full data center racks.

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8.192TB/s
Peak HBM4 Bandwidth
471.9TFLOPS
Stallion Tensor Compute
131TB/s
3U Rack Throughput
2027
FV-RACK Series Delivery

Product Ecosystem

From Silicon Dies to Turnkey Rack Systems.

Memory Chipset

Gallium HBM4 Architecture

Direct die-to-memory attach providing 8.192 TB/s throughput for data-intensive AI models and high-efficiency training clusters.

Bandwidth8.192+ TB/s
TechnologyHBM4 Stacked
Cubes4-Stack Flagship
InterfaceCoWoS 2.5D
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Gallium HBM4 Memory Architecture
Gallium SeriesMemory Architecture
GPU Accelerator

Stallion AI Accelerator

2nm GAAFET compute die optimized for tensor execution and high-bandwidth memory access across dense AI infrastructure.

Compute59.0 TFLOPS FP32
Tensor Ops471.9 TFLOPS
InterconnectPCIe 6 / CXL 3.1
Process Node2nm GAAFET
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Stallion GPU Compute Die
Stallion SeriesGPU Compute Die

Enterprise Systems · 2027 Roadmap

1U, 2U & 3U High-Density Blade Servers.

FairView Blade Server Datacenter Rack
FairView Systems · 2027 Delivery

FV-RACK Series

Unified GPU + HBM4 Compute Matrix

1U
Apex
32.768 TB/s
Aggregate BW
  • Compute4x Stallion S80I
  • Use CaseHigh-Density Inference & Edge
  • CoolingHigh-Static Air
  • NetworkDual 800GbE OSFP
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2U
Sovereign
65.536 TB/s
Aggregate BW
  • Compute8x Stallion S80I
  • Use CaseLLM Training & Hyperscale AI
  • CoolingDirect-to-Chip Liquid
  • NetworkQuad 800GbE OSFP
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3U
Megascale
131.072 TB/s
Aggregate BW
  • Compute16x Stallion S80I
  • Use CaseRack-Scale Supercomputing
  • CoolingFull Liquid Immersion
  • Network8x 800GbE OSFP
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Silicon Architecture

The Unified CoWoS 2.5D Package.

Host CPU → I/O Die → Stallion Compute → Gallium Controller → 4x HBM4 Memory Cubes.

Flagship package block diagramHost CPU connects over PCIe Gen6 and CXL 3.1 to the I/O die. UCIe carries MMIO to Stallion. Stallion L2 drives Gallium-HX. Gallium drives four partner HBM4 cubes. A sidecar carries command, credit, and telemetry only.PACKAGE · CoWoS-CLASS 2.5D · FIRST SILICON H4-ONLYHost CPUboard / CXL hostI/O DIEPCIe Gen6 x16CXL 3.1UCIe-E → StallionSTALLION COMPUTECommand processor2D mesh NoCSM arrayPartitioned L2Refresh hint engineSidecar APB / UCIeGALLIUM-HX CHIPLETCredit / QoS plane32-ch remapRAS / DRFM policyH4 PHY wrappercube 0cube 1cube 2cube 3HBM datasidecar
Flagship attach. Gallium-HX is a separate chiplet. Cubes are partner DRAM stacks. UCIe never carries HBM beats.
Host / I/OStallionGallium + cubes
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The Lineage & Vision

Historical Lineage & Multi-Sector Roadmap.

Rooted in the pioneering spirit of Silicon Valley, expanding advanced hardware into AI data centers, autonomous vehicles, and orbital systems.

1957 – 1970s

Epoch 1.0: Planar Silicon Foundations

Fairchild Semiconductor pioneers the planar manufacturing process, establishing the silicon integrated circuit foundation of Silicon Valley.

1980s – 2010s

Epoch 2.0: Microprocessors & Distributed Cloud

Discrete CPUs, early graphics accelerators, and distributed networks power the global expansion of digital infrastructure.

2026 – 2027+

Epoch 3.0: Unified Memory & Blade Systems

FairView integrates 8.192 TB/s Gallium HBM4 memory directly with Stallion GPU compute dies across 2.5D packages and enterprise blade servers.

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Connect with our engineering team for design-in specifications and 2027 hardware availability.

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