Purpose-Built Silicon
for Advanced AI.
Eliminating the 1,000W generality tax. Turnkey, air-cooled silicon-to-software platforms — unifying HBM4 memory and MPU compute from die to rack.
From Silicon Dies to Turnkey Rack Systems.
Two flagship products. One unified architecture. Infinite AI scale.
Gallium HBM4 Architecture
Direct die-to-memory attach providing 16.0 TB/s throughput for data-intensive AI models and high-efficiency training clusters. The Gallium Series redefines what memory bandwidth means for next-generation AI infrastructure.
Stallion AI Accelerator
2nm GAAFET (TSMC N2) compute die optimized for tensor execution and high-bandwidth memory access across dense AI infrastructure. The Stallion Series delivers unmatched parallel compute for LLM training, inference, and hyperscale AI workloads.
High-Intensity AI Silicon
Stallion pairs programmable matrix execution with a wide-bus Gallium HBM4 interface in one package.
Stallionâ„¢ MPU
350W Pure Systolic Tensor Engine
350W air-cooled systolic tensor engines for deterministic inference.
Galliumâ„¢ Fabric
Direct Zero-Copy Topology
Programmable scale-out interconnect with a direct memory-to-memory path, from a 2U blade to a rack.
Tiered NVM Architecture
Near-Memory Data Access
Target architecture: tiered memory integration behind a technology-independent interface, with the physical memory cell qualified per node. Breaks the memory wall by optimizing near-memory data access for massive model parameters.
KV-Cache Subsystem
High-Throughput Persistent Memory
High-throughput persistent storage subsystem engineered specifically for continuous agentic context memory and massive KV-cache retention, ensuring zero-latency recall for BFSI pipelines.
Package Architecture
Matrix Execution
Stallion assigns the die to programmable matrix execution and a wide memory interface.
Programmable Matrix Path
The matrix instruction set stays programmable across transformer, mixture-of-experts, and state-space workloads.
The Fairview Solution
Fairview Semiconductor re-architects compute from the transistor level up—combining maximum math-to-die density with programmable linear algebra primitives and next-generation wide-bus HBM4 integration.
Stallion Architecture Summary
Design targets for the Stallion and Gallium package. Not measured silicon.
| Feature | Fairview Semiconductor |
|---|---|
| Math-to-Die Area | High (>35% flexible tensor execution) |
| Memory Architecture | 16,384-bit HBM4 Wide-Bus Interface |
| Model Versatility | High (Programmable Matrix ISA) |
| Sparsity Acceleration | Hardware-Native 2:4 Sparsity Decoding |
| Package Balance | Balanced Compute-to-Bandwidth Ratio |
1U, 2U & 3U High-Density Blade Servers.
- Compute4x Stallion S80I
- Use CaseHigh-Density Inference & Edge
- CoolingHigh-Static Air
- NetworkDual 800GbE OSFP
- Compute8x Stallion S80I
- Use CaseLLM Training & Hyperscale AI
- CoolingDirect-to-Chip Liquid
- NetworkQuad 800GbE OSFP
- Compute16x Stallion S80I
- Use CaseRack-Scale Supercomputing
- CoolingFull Liquid Immersion
- Network8x 800GbE OSFP
Purpose-Built for Sovereign & Enterprise Infrastructure.
Delivering dedicated, high-efficiency compute platforms tailored for regulated banking, sovereign national security, and high-availability enterprise infrastructure.
Algorithmic Trade Surveillance & Sovereign Core-Banking LLMs
Ultra-low latency, deterministic inference for algorithmic trade surveillance, AML monitoring, and sovereign core-banking LLMs executing directly on-premise without third-party API exposure.
The 3Dx3D Heterogeneous Glass Core Substrate.
Target co-packaged architecture (product family).
Shipping architecture is electrical: Stallion S10 MPU plus Gallium HBM4 over direct Cu-Cu hybrid bonding on a 3.2 ppm/K glass core substrate that ships with a reserved waveguide trench. FV-Link 4.0 co-packaged optics unlock in Phase 2 (Design Goal). All optical specifications are design targets pending PIC MPW validation.
Eliminating the Memory Wall.
From single silicon dies to datacenter racks — conventional AI architectures separate compute from memory, creating severe latency bottlenecks. FairView unifies high-throughput Stallion MPU dies directly with Gallium HBM4 memory on a single 2.5D substrate, scaling into turnkey enterprise blade systems for 2027–2028 deployments.
Request Early Access & Technical Datasheets.
Direct engagement for Stallion MPU silicon samples, Gallium HBM4 pinout specs, and official engineering datasheets.